MC10H115

http://onsemi.com

6

PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

−A−

B

F

C

S

H

G

D

J

L

M

16 PL

SEATING

18

9

16

K

PLANE

−T−

M

A

M

0.25 (0.010)

T

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.740

0.770

18.80

19.55

B

0.250

0.270

6.35

6.85

C

0.145

0.175

3.69

4.44

D

0.015

0.021

0.39

0.53

F

0.040

0.70

1.02

1.77

G

0.100 BSC

2.54 BSC

H

0.050 BSC

1.27 BSC

J

0.008

0.015

0.21

0.38

K

0.110

0.130

2.80

3.30

L

0.295

0.305

7.50

7.74

M

0

10

0

10

S

0.020

0.040

0.51

1.01

_

_

_

_

PDIP−16

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648−08

ISSUE R

ON Semiconductor and

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