MC10H135FNR2 datasheet(6/7 Pages) ONSEMI

Nome de Peças	MC10H135FNR2

Descrição Electrónicos	Dual J?묷 Master?뭆lave Flip?묯lop

Download	7 Pages

Scroll/Zoom	100%

Fabricante Electrônico	ONSEMI [ON Semiconductor]

Página de início	http://www.onsemi.com

Logo

6 / 7 page

MC10H135

http://onsemi.com

6

PACKAGE DIMENSIONS

SOEIAJ−16

CASE 966−01

ISSUE A

HE

A1

DIM

MIN

MAX

MIN

MAX

INCHES

−−−

2.05

−−−

0.081

MILLIMETERS

0.05

0.20

0.002

0.008

0.35

0.50

0.014

0.020

0.10

0.20

0.007

0.011

9.90

10.50

0.390

0.413

5.10

5.45

0.201

0.215

1.27 BSC

0.050 BSC

7.40

8.20

0.291

0.323

0.50

0.85

0.020

0.033

1.10

1.50

0.043

0.059

0

0.70

0.90

0.028

0.035

−−−

0.78

−−−

0.031

A1

HE

Q1

LE

_ 10_

0

_ 10_

LE

Q1

_

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS AND ARE MEASURED

AT THE PARTING LINE. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE.

4. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

5. THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

M

L

DETAIL P

VIEW P

c

A

b

e

M

0.13 (0.005)

0.10 (0.004)

1

16

9

8

D

Z

E

A

b

c

D

E

e

L

M

Z

CDIP−16

L SUFFIX

CERAMIC DIP PACKAGE

CASE 620A−01

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)

WHERE THE LEAD ENTERS THE CERAMIC

BODY.

5 THIS DRAWING REPLACES OBSOLETE

CASE OUTLINE 620−10.

F

E

N

K

C

SEATING

PLANE

A

M

0.25 (0.010)

T

M

L

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.750

0.785

19.05

19.93

B

0.240

0.295

6.10

7.49

C

−−−

0.200

−−−

5.08

D

0.015

0.020

0.39

0.50

E

0.050 BSC

1.27 BSC

F

0.055

0.065

1.40

1.65

G

0.100 BSC

2.54 BSC

H

0.008

0.015

0.21

0.38

K

0.125

0.170

3.18

4.31

L

0.300 BSC

7.62 BSC

M

0

15

0

15

N

0.020

0.040

0.51

1.01

__

A

B

A

B

16

1

9

8

G

16X

D

B

M

0.25 (0.010)

T

16X

J

Nº de peça semelhante - MC10H135FNR2

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
ON Semiconductor	MC10H135FNR2G	140Kb / 5P	Dual J?륦 Master?륲lave Flip?륡lop August, 2016 ??Rev. 9

More results

Descrição semelhante - MC10H135FNR2

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
ON Semiconductor	MC14027B	103Kb / 8P	Dual J?묷 Flip?묯lop August, 2005 ??Rev. 6
	MC10H131	153Kb / 7P	Dual D Type Master?뭆lave Flip?묯lop February, 2006 ??Rev. 7
	MC10H176	153Kb / 7P	Hex D Master?뭆lave Flip?묯lop February, 2006 ??Rev. 7
	MC10H186	149Kb / 5P	Hex D Master?뭆lave Flip?묯lop with Reset February, 2006 ??Rev. 7
Toshiba Semiconductor	TC4027BP	270Kb / 7P	DUAL J-K MASTER-SLAVE FLIP FLOP
ON Semiconductor	MC10135	112Kb / 8P	Dual J-K Master-Slave Flip-Flop January, 2002 ??Rev. 7
Micro Electronics	MMC4027	113Kb / 4P	DUAL J-K MASTER SLAVE FLIP FLOP
ON Semiconductor	MC10H135	97Kb / 3P	Dual J-K Master-Slave Flip-Flop REV 6
ON Semiconductor	MC10135	110Kb / 5P	Dual J-K Master-Slave Flip-Flop 1996 REV 5
Toshiba Semiconductor	TC4027BP	329Kb / 9P	Dual J-K Master-Slave Flip Flop

More results

MC10H135FNR2 Folha de dados(PDF) 6 Page - ON Semiconductor

MC10H135FNR2 Folha de dados(HTML) 6 Page - ON Semiconductor

Nº de peça semelhante - MC10H135FNR2

Descrição semelhante - MC10H135FNR2

Html Pages

1 2 3 4 5 6 7

Folha de dados Download

Ligação URL