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MC100LVEL32DTR2G Folha de dados(PDF) 2 Page - ON Semiconductor

Nome de Peças MC100LVEL32DTR2G
Descrição Electrónicos  3.3V ECL 첨2 Divider
Download  8 Pages
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Fabricante Electrônico  ONSEMI [ON Semiconductor]
Página de início  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC100LVEL32DTR2G Folha de dados(HTML) 2 Page - ON Semiconductor

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MC100LVEL32
http://onsemi.com
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Figure 1. Logic Diagram and Pinout Assessment
1
2
5
6
7
8
Q
VEE
VCC
Q
CLK
VBB
R
÷2
Reset
CLK
Table 1. PIN DESCRIPTION
Pin
Function
CLK*, CLK**
Q, Q
Reset*
VBB
VCC
VEE
EP
ECL Differential Clock Inputs
ECL Differential Data ÷2 Outputs
ECL Asynch Reset
Reference Voltage Output
Positive Supply
Negative Supply
Exposed pad must be connected to a
sufficient thermal conduit. Electrically
connect to the most negative supply or
leave floating open.
*Pin will default low when left open, per internal 75 K pull−down to
VEE.
** Pin will default to VCC/2 when left open per internal 75 KW pull-
down to VEE and 75 KW pull−up to VCC.
Table 2. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8 to 0
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8 to 0
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI v VCC
VI w VEE
6 to 0
−6 to 0
V
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI v VCC
VI w VEE
6 to 0
−6 to 0
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−8
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.


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