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MC14513BCP Folha de dados(PDF) 1 Page - ON Semiconductor |
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MC14513BCP Folha de dados(HTML) 1 Page - ON Semiconductor |
1 / 10 page © Semiconductor Components Industries, LLC, 2006 June, 2006 − Rev. 6 1 Publication Order Number: MC14513B/D MC14513B BCD−To−Seven Segment Latch/Decoder/Driver CMOS MSI (Low−Power Complementary MOS) The MC14513B BCD−to−seven segment latch/decoder/driver is constructed with complementary MOS (CMOS) enhancement mode devices and NPN bipolar output drivers in a single monolithic structure. The circuit provides the functions of a 4−bit storage latch, an 8421 BCD−to−seven segment decoder, and has output drive capability. Lamp test (LT), blanking (BI), and latch enable (LE) inputs are used to test the display, to turn−off or pulse modulate the brightness of the display, and to store a BCD code, respectively. The Ripple Blanking Input (RBI) and Ripple Blanking Output (RBO) can be used to suppress either leading or trailing zeroes. It can be used with seven−segment light emitting diodes (LED), incandescent, fluorescent, gas discharge, or liquid crystal readouts either directly or indirectly. Applications include instrument (e.g., counter, DVM, etc.) display driver, computer/calculator display driver, cockpit display driver, and various clock, watch, and timer uses. Features • Low Logic Circuit Power Dissipation • High−Current Sourcing Outputs (Up to 25 mA) • Latch Storage of Binary Input • Blanking Input • Lamp Test Provision • Readout Blanking on all Illegal Input Combinations • Lamp Intensity Modulation Capability • Time Share (Multiplexing) Capability • Adds Ripple Blanking In, Ripple Blanking Out to MC14511B • Supply Voltage Range = 3.0 V to 18 V • Capable of Driving Two Low−Power TTL Loads, One Low−Power Schottky TTL Load to Two HTL Loads Over the Rated Temperature Range • Pb−Free Package is Available* MAXIMUM RATINGS (Voltages Referenced to VSS) Parameter Symbol Value Unit DC Supply Voltage Range VDD −0.5 to +18.0 V Input Voltage Range, All Inputs Vin −0.5 to VDD +0.5 V DC Current Drain per Input Pin I 10 mA Power Dissipation per Package (Note 1) PD 500 mW Operating Temperature Range TA −55 to +125 °C Storage Temperature Range Tstg −65 to +150 °C Maximum Continuous Output Drive Current (Source) per Output IOHmax 25 mA Maximum Continuous Output Power (Source) per Output (Note 2) POHmax 50 mW Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/ _C From 65_C To 125_C 2. POHmax = IOH (VDD − VOH) http://onsemi.com A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package MARKING DIAGRAM 1 18 PDIP−18 P SUFFIX CASE 707 MC14513BCP AWLYYWWG 1 Device Package Shipping ORDERING INFORMATION MC14513BCP PDIP−18 20 Units/Rail MC14513BCPG PDIP−18 (Pb−Free) 20 Units/Rail This device contains protection circuitry to protect the inputs against damage due to high static voltages or electric fields. However, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high−impedance circuit. A destructive high current mode may occur if Vin and Vout are not constrained to the range VSS v (Vin or Vout) v VDD. Due to the sourcing capability of this circuit, damage can occur to the device if VDD is applied, and the outputs are shorted to VSS and are at a logical 1 (See Maximum Ratings). Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. |
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