2000 Feb 14

7

Philips Semiconductors

Product specification

SMA ultra fast soft-recovery

controlled avalanche rectifiers

BYG26 series

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD124

99-10-22

DO-214AC

0

2.5

5 mm

scale

Transfer-moulded thermo-setting plastic small rectangular surface mounted package;

2 connectors

SOD124

UNIT

b

A1

cD

E

Q

mm

1.6

1.4

0.2

0.05

2.8

2.4

4.5

4.3

H

5.5

5.1

3.3

2.7

DIMENSIONS (mm are the original dimensions)

A

2.3

2.0

D

H

A

E

b

(1)

A1

Q

c

Note

1. The marking band indicates the cathode.