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NBSG16VS Folha de dados(PDF) 4 Page - ON Semiconductor

Nome de Peças NBSG16VS
Descrição Electrónicos  2.5V/3.3V SiGe Differential Receiver/Driver with Variable Output Swing
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Fabricante Electrônico  ONSEMI [ON Semiconductor]
Página de início  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

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Table 3. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor (D, D)
75 k
W
Internal Input Pullup Resistor (D)
36.5 k
W
ESD Protection
Human Body Model
Machine Model
> 2 kV
> 100 V
Moisture Sensitivity (Note 4)
Pb Pkg
Pb−Free Pkg
FCBGA−16
QFN−16
Level 3
Level 1
N/A
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
192
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
4. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
Positive Power Supply
VEE = 0 V
3.6
V
VEE
Negative Power Supply
VCC = 0 V
−3.6
V
VI
Positive Input
Negative Input
VEE = 0 V
VCC = 0 V
VI v VCC
VI w VEE
3.6
−3.6
V
V
VINPP
Differential Input Voltage
|D − D|
VCC − VEE w 2.8 V
VCC − VEE t 2.8 V
2.8
|VCC − VEE|
V
V
IOUT
Output Current
Continuous
Surge
25
50
mA
mA
IIN
Input Current Through RT (50 W Resistor)
Static
Surge
45
80
mA
mA
IBB
VBB Sink/Source
1
mA
IMM
VMM Sink/Source
1
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
(Note 5)
0 lfpm
500 lfpm
0 lfpm
500 lfpm
16 FCBGA
16 FCBGA
16 QFN
16 QFN
108
86
41.6
35.2
°C/W
°C/W
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
2S2P (Note 5)
2S2P (Note 6)
16 FCBGA
16 QFN
5.0
4.0
°C/W
°C/W
Tsol
Wave Solder
Pb
Pb−Free
225
225
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
5. JEDEC standard 51−6 multilayer board − 2S2P (2 signal, 2 power).
6. JEDEC standards multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.


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