9

Metallization Mask Layout

The photographs and dimensions of each chip represent a chip

when it is part of the wafer. When the wafer is cut into chips, the

the chip. Therefore, the isolated chip is actually 7mils (0.17mm)

larger in both dimensions.

Dimensions in parentheses are in millimeters and are derived from

the basic inch dimensions as indicated. Grid graduations are in mils

NOTE: Numbers in pads are for 8 lead DIP and TO-5 Can and

numbers outside of chip are for 14 lead DIP.

0

102030

40

50 53

90

80

70

60

50

40

30

20

10

0

7

1

10

11

12

4 - 10

(0.102 - 0.254)

50 - 58

(1.270 - 1.473)

87 - 95

(2.210 - 2.403)

6

4

2

CA3290, CA3290A