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CA3290A Folha de dados(PDF) 9 Page - Intersil Corporation |
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CA3290A Folha de dados(HTML) 9 Page - Intersil Corporation |
9 / 10 page 9 Metallization Mask Layout The photographs and dimensions of each chip represent a chip when it is part of the wafer. When the wafer is cut into chips, the cleavage angles are 57o instead of 90o with respect to the face of the chip. Therefore, the isolated chip is actually 7mils (0.17mm) larger in both dimensions. Dimensions in parentheses are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch) NOTE: Numbers in pads are for 8 lead DIP and TO-5 Can and numbers outside of chip are for 14 lead DIP. 0 102030 40 50 53 90 80 70 60 50 40 30 20 10 0 7 1 10 11 12 4 - 10 (0.102 - 0.254) 50 - 58 (1.270 - 1.473) 87 - 95 (2.210 - 2.403) 6 4 2 CA3290, CA3290A |
Nº de peça semelhante - CA3290A |
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Descrição semelhante - CA3290A |
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