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AM29LV320ML112REF Folha de dados(PDF) 6 Page - Advanced Micro Devices

Nome de Peças AM29LV320ML112REF
Descrição Electrónicos  32 Megabit (2 M x 16-Bit/4 M x 8-Bit) MirrorBit??3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O??Control
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Fabricante Electrônico  AMD [Advanced Micro Devices]
Página de início  http://www.amd.com
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Am29LV320MH/L
26517B4 January 31, 2007
D A TA
SH EE T
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . 10
Table 1. Device Bus Operations ..................................................... 10
VersatileIO
™ (V
IO) Control ..................................................... 10
Requirements for Reading Array Data ................................... 11
Page Mode Read ............................................................................11
Writing Commands/Command Sequences ............................ 11
Write Buffer .....................................................................................11
Accelerated Program Operation ......................................................11
Autoselect Functions .......................................................................11
Automatic Sleep Mode ........................................................... 12
RESET#: Hardware Reset Pin ............................................... 12
Output Disable Mode .............................................................. 12
Table 2. Sector Address Table........................................................ 13
Table 3. Autoselect Codes, (High Voltage Method) ....................... 15
Sector Group Protection and Unprotection ............................. 16
Table 4. Sector Group Protection/Unprotection Address Table ..... 16
Temporary Sector Group Unprotect ....................................... 17
Figure 1. Temporary Sector Group Unprotect Operation ................17
Figure 2. In-System Sector Group Protect/Unprotect Algorithms ...18
Secured Silicon Sector Flash Memory Region ....................... 19
Table 5. Secured Silicon Sector Contents ...................................... 19
Figure 3. Secured Silicon Sector Protect Verify ..............................20
Hardware Data Protection ...................................................... 20
Low VCC Write Inhibit .....................................................................20
Write Pulse “Glitch” Protection ........................................................20
Logical Inhibit ..................................................................................20
Power-Up Write Inhibit ....................................................................20
Common Flash Memory Interface (CFI) . . . . . . . 20
Table 6. CFI Query Identification String ..........................................21
Table 7. System Interface String..................................................... 21
Table 8. Device Geometry Definition ..............................................22
Table 9. Primary Vendor-Specific Extended Query ........................23
Command Definitions . . . . . . . . . . . . . . . . . . . . . 24
Reading Array Data ................................................................ 24
Reset Command ..................................................................... 24
Autoselect Command Sequence ............................................ 24
Enter Secured Silicon Sector/Exit Secured Silicon Sector
Command Sequence .............................................................. 25
Word/Byte Program Command Sequence ............................. 25
Unlock Bypass Command Sequence ..............................................25
Write Buffer Programming ...............................................................25
Accelerated Program ......................................................................26
Figure 4. Write Buffer Programming Operation ...............................27
Figure 5. Program Operation ..........................................................28
Program Suspend/Program Resume Command Sequence ... 28
Figure 6. Program Suspend/Program Resume ...............................29
Chip Erase Command Sequence ........................................... 29
Sector Erase Command Sequence ........................................ 29
Erase Suspend/Erase Resume Commands ........................... 30
Figure 7. Erase Operation .............................................................. 30
Table 10. Command Definitions (x16 Mode, BYTE# = V
IH) ........... 31
Table 11. Command Definitions (x8 Mode, BYTE# = V
IL).............. 32
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 33
DQ7: Data# Polling ................................................................. 33
Figure 8. Data# Polling Algorithm .................................................. 33
DQ6: Toggle Bit I .................................................................... 34
Figure 9. Toggle Bit Algorithm ........................................................ 35
DQ2: Toggle Bit II ................................................................... 35
Reading Toggle Bits DQ6/DQ2 ............................................... 35
DQ5: Exceeded Timing Limits ................................................ 36
DQ3: Sector Erase Timer ....................................................... 36
DQ1: Write-to-Buffer Abort ..................................................... 36
Table 12. Write Operation Status................................................... 36
Figure 10. Maximum Negative Overshoot Waveform ................... 37
Figure 11. Maximum Positive Overshoot Waveform ..................... 37
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 37
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 12. Test Setup .................................................................... 39
Table 13. Test Specifications ......................................................... 39
Key to Switching Waveforms. . . . . . . . . . . . . . . . 39
Figure 13. Input Waveforms and
Measurement Levels ...................................................................... 39
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 40
Read-Only Operations ........................................................... 40
Figure 14. Read Operation Timing ................................................. 40
Figure 15. Page Read Timings ...................................................... 41
Hardware Reset (RESET#) .................................................... 42
Figure 16. Reset Timings ............................................................... 42
Erase and Program Operations .............................................. 43
Figure 17. Program Operation Timings .......................................... 44
Figure 18. Accelerated Program Timing Diagram .......................... 44
Figure 19. Chip/Sector Erase Operation Timings .......................... 45
Figure 20. Data# Polling Timings (During Embedded Algorithms) . 46
Figure 21. Toggle Bit Timings (During Embedded Algorithms) ...... 47
Figure 22. DQ2 vs. DQ6 ................................................................. 47
Temporary Sector Unprotect .................................................. 48
Figure 23. Temporary Sector Group Unprotect Timing Diagram ... 48
Figure 24. Sector Group Protect and Unprotect Timing Diagram .. 49
Alternate CE# Controlled Erase and Program Operations ..... 50
Figure 25. Alternate CE# Controlled Write (Erase/Program)
Operation Timings .......................................................................... 51
Erase And Programming Performance. . . . . . . . 52
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 52
TSOP Pin and BGA Package Capacitance . . . . . 53
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 54
TS056/TSR056—56-Pin Standard and Reverse Pinout Thin
Small Outline Package (TSOP) .............................................. 54
LAA064—64-Ball Fortified Ball Grid Array (FBGA) 13 x 11 mm
Package .................................................................................. 55
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 56


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