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KMPC860PZQ66D4 Folha de dados(PDF) 7 Page - Freescale Semiconductor, Inc

Nome de Peças KMPC860PZQ66D4
Descrição Electrónicos  Hardware Specifications
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Fabricante Electrônico  FREESCALE [Freescale Semiconductor, Inc]
Página de início  http://www.freescale.com
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MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
7
Power Dissipation
5
Power Dissipation
Table 5 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1,
where CPU frequency is twice the bus speed.
NOTE
Values in Table 5 represent VDDL-based power dissipation and do not include I/O
power dissipation over VDDH. I/O power dissipation varies widely by application
due to buffer current, depending on external circuitry.
Table 4. MPC860 Thermal Resistance Data
Rating
Environment
Symbol
ZP
MPC860P
ZQ / VR
MPC860P
Unit
Mold Compound Thickness
0.85
1.15
mm
Junction-to-ambient 1
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Natural convection
Single-layer board (1s)
RθJA
2
2
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
34
34
°C/W
Four-layer board (2s2p)
RθJMA
3
3
Per JEDEC JESD51-6 with the board horizontal.
22
22
Airflow (200 ft/min)
Single-layer board (1s)
RθJMA
3
27
27
Four-layer board (2s2p)
RθJMA
3
18
18
Junction-to-board 4
4
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
RθJB
14
13
Junction-to-case 5
5
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad
packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from
the junction to the exposed pad without contact resistance.
RθJC
6
8
Junction-to-package top 6
6
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
Natural convection
ΨJT
2
2
Table 5. Power Dissipation (PD)
Die Revision
Frequency (MHz)
Typical 1
1
Typical power dissipation is measured at 3.3 V.
Maximum 2
2
Maximum power dissipation is measured at 3.5 V.
Unit
D.4
(1:1 mode)
50
656
735
mW
66
TBD
TBD
mW
D.4
(2:1 mode)
66
722
762
mW
80
851
909
mW


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