Data Sheet

7.0 Recommended Operating Conditions at Room Temperature

Table 4: Recommended Operating Conditions at Room Temperature

Parameters

Symbol

Min.

Typ.

Max.

Units

Power supply

VDD

4.5

5.0

5.5

V

Input clock pulses high level

Vih

(1)

3.0

5.0

VDD

V

Input clock pulse low level

Vil

(1)

0

0

0.8

V

Operating high level exposed output

IOUT

(2)

See Note 2

Clock frequency

Fclk

(3)

0.1

2.0

5.0

MHz

Clock pulse duty cycle

Duty

(4)

25

%

Clock pulse high durations

tw

0.125

µsec

Integration time

Tint

0.864

10

ms

Operating temperature

Top

25

50

Notes:

1.

Applies to both CP and SP

2.

The output is a current that is proportional to the charges, which are integrated on the phototransistor’s base via photon-to-electron conversion. For its conversion

to voltage pixels see Figure 4.

3.

Although the clock frequency, Fclk, will operate the device at less than 100kHz, it is recommended that the device be operated above 500kHz to avoid

complication of leakage current build-up. In applications using long CIS module length, such as an array of image sensor > 27, increases in the readout time, i.e.,

increases tint, hence, leakage current build-up occurs.

4.

The clock duty cycle is normally set to 25 percent. However, it can operate with duty cycle as large as 50 percent, which will allow more reset time at the expense

of video pixel readout time.

8

AMI Semiconductor –May 06, M-20567-001

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