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CXXXUT230-S0100 Folha de dados(PDF) 1 Page - Cree, Inc

Nome de Peças CXXXUT230-S0100
Descrição Electrónicos  UltraThin??LEDs
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Fabricante Electrônico  CREE [Cree, Inc]
Página de início  http://www.cree.com/
Logo CREE - Cree, Inc

CXXXUT230-S0100 Folha de dados(HTML) 1 Page - Cree, Inc

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Subject to change without notice.
www.cree.com
FEATURES
Small Chip – 230 x 230 x 85 μm
Low Forward Voltage
3.3V Typical at 20 mA
UT LED Performance
8.0 mW min. (455–475 nm) Blue
Single Wire Bond Structure
Class 2 ESD Rating
APPLICATIONS
Mobile Phone Keypads
White LEDs
Blue LEDs
Audio Product Display Lighting
Mobile Appliance Keypads
UltraThin™ LEDs
CxxxUT230-S000
Cree’s UltraThin LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC® substrate to deliver
superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low
forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications and the
ability to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and thinner
form factors are required.
CxxxXT230-S000 Chip Diagram
Top View
Bottom View
G•SiC LED Chip
230 x 230 μm
SiC Substrate
h = 85 μm
Backside
Metallization
80 x 80 μm
Gold Bond Pad
105 μm Diameter
Die Cross Section
Cathode (-)
Anode (+)
SiC Substrate
Bottom Surface
150 x 150 μm
Mesa (junction)
176 x 176 μm
InGaN


Nº de peça semelhante - CXXXUT230-S0100

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Descrição semelhante - CXXXUT230-S0100

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