2000 Nov 27

11

Philips Semiconductors

Product specification

Sensor Conditioning Electronic

UZZ9001

PACKAGE OUTLINE

UNIT

A

max.

cD

(1)

E

(1)

(1)

Q

Z

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

15.6

15.2

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT137-1

X

12

24

θ

A

D

Q

detail X

E

Z

c

L

13

(A )

3

A

y

0.25

075E05

MS-013

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.61

0.60

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

e

1

0

5

10 mm

scale

SO24: plastic small outline package; 24 leads; body width 7.5 mm

SOT137-1

97-05-22

99-12-27