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FUJITSU SEMICONDUCTOR

DATA SHEET

SMALL OUTLINE L-LEADED PACKAGE

8 PIN PLASTIC

8-pin plastic SOP

Lead pitch

1.27 mm

Package width

×

package length

3.9

× 5.05 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

1.75 mm MAX

Weight

0.06 g

8-pin plastic SOP

(FPT-8P-M02)

(FPT-8P-M02)

C

2002 FUJITSU LIMITED F08004S-c-4-7

1.27(.050)

3.90±0.30

6.00±0.40

+.010

–0.20

+0.25

5.05

(.154±.012) (.236±.016)

0.10(.004)

14

5

8

0.44±0.08

(.017±.003)

–0.07

+0.03

0.22

.009

+.001

–.003

45˚

0.40(.016)

"A"

0~8˚

0.25(.010)

(Mounting height)

Details of "A" part

1.55±0.20

(.061±.008)

0.50±0.20

(.020±.008)

0.60±0.15

(.024±.006)

0.15±0.10

(.006±.004)

(Stand off)

0.10(.004)

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

FPT-8P-M02

0212

Note 1) *1 : These dimensions include resin protrusion.

Note 2) *2 : These dimensions do not include resin protrusion.

Note 3) Pins width and pins thickness include plating thickness.

Note 4) Pins width do not include tie bar cutting remainder.