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HLMP-CY27-VY0DD Folha de dados(PDF) 7 Page - AVAGO TECHNOLOGIES LIMITED

Nome de Peças HLMP-CY27-VY0DD
Descrição Electrónicos  Precision Optical Performance 5mm Round Warm White LED Lamps
Download  9 Pages
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Fabricante Electrônico  AVAGO [AVAGO TECHNOLOGIES LIMITED]
Página de início  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

HLMP-CY27-VY0DD Folha de dados(HTML) 7 Page - AVAGO TECHNOLOGIES LIMITED

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Avago Technologies LED configuration
Precautions:
Lead Forming:
• TheleadsofanLEDlampmaybeperformedorcutto
lengthpriortoinsertionandsolderingonPCboard.
• Ifleadformingisrequiredbeforesoldering,caremust
betakentoavoidanyexcessivemechanicalstressthat
induced into the LED package. Otherwise, cut the
leads to applicable length after soldering process at
roomtemperature.Thesolderjointformedwillabsorb
the mechanical stress, due to the lead cutting, from
travelingtotheLEDchipdieattachandwirebond.
• For better control, it is recommended to use proper
tooltopreciselyformandcuttheleadstoapplicable
lengthratherthandoingitmanually.
Soldering condition:
• Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
• Theclosestmanualsolderingdistanceofthesoldering
heat source (soldering iron’s tip) to the body is
1.59mm.SolderingtheLEDcloserthan1.59mmmight
damagetheLED.
• Recommendedsolderingcondition:
Wave Soldering
Manual Solder
Dipping
Pre-heat temperature
05 °C Max.
-
Preheat time
30 sec Max
-
Peak temperature
50 °C Max.
60 °C Max.
Dwell time
3 sec Max.
5 sec Max
• Wave soldering parameter must be set and maintain
according to the recommended temperature and
dwelltime.Customerisadvisedtodailycheckonthe
soldering profile to ensure that the soldering profile
is always conforming to recommended soldering
condition.
Note:
1. PCB with different size and design (component density) will
have different heat mass (heat capacity). This might cause a
changeintemperatureexperiencedbytheboardifsamewave
solderingsettingisused.So,itisrecommendedtore-calibrate
thesolderingprofileagainbeforeloadinganewtypeofPCB.
2. Avago Technologies’ high brightness LED are using high
efficiency LED die with single wire bond as shown below.
Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature is
not exceeding 250°C. Over-stressing the LED during soldering
process might cause premature failure to the LED due to
delamination.
1.59mm
Note:ElectricalconnectionbetweenbottomsurfaceofLEDdieand
theleadframematerialthroughconductivepasteofsolder.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
solderingprocess.
• Atelevatedtemperature,theLEDismoresusceptible
to mechanical stress.Therefore, PCB must allowed to
cool down to room temperature prior to handling,
whichincludesremovalofjigs,fixturesorpallet.
• Specialattentionmustbegiventoboardfabrication,
solder masking, surface platting and lead holes size
andcomponentorientationtoassurethesolderability.
• RecommendedPCboardplatedthroughholessizefor
LEDcomponentleads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.457 x 0.457 mm
(0.08 x 0.08 inch)
0.646 mm
(0.05 inch)
0.976 to .078 mm
(0.038 to 0.04 inch)
0.508 x 0.508 mm
(0.00 x 0.00 inch)
0.78 mm
(0.08 inch)
.049 to .50 mm
(0.04 to 0.045 inch)
• Under sizing of plated through hole can lead to
twisting or improper LED placement during auto
insertion.Oversizingplatedthroughholecanleadto
mechanicalstressontheepoxylensduringclinching.
Note: Refer to application note AN1027 for more information on
solderingLEDcomponents.
InGaN Device
Anode


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