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HLMP-NS31 Folha de dados(PDF) 5 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-NS31 Folha de dados(HTML) 5 Page - AVAGO TECHNOLOGIES LIMITED |
5 / 6 page 5 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attached and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Condition: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoffs. • Recommended soldering condition: Wave Soldering Manual Solder Dipping Pre-heat temperature 05 ºC Max. - Pre-heat time 30 sec Max. - Peak temperature 50 ºC Max. 60 ºC Max. Dwell time 3 sec Max. 5 sec Max. • Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25 ºC before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole size for LED component leads: LED component lead size Diagonal Plated through hole diameter 0.457 x 0.457 mm (0.08 x 0.08 inch) 0.646 mm (0.05 inch) 0.976 to .078 mm (0.038 to 0.04 inch) 0.508 x 0.508 mm (0.00 x 0.00 inch) 0.78 mm (0.08 inch) .049 to .50 mm (0.04 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA 250 200 150 FLUXING TURBULENT WAVE PREHEAT TIME - SECONDS 100 50 30 0 10 20 304 0 50 607 0 809 0 100 LAMINAR WAVE HOT AIR KNIFE |
Nº de peça semelhante - HLMP-NS31 |
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Descrição semelhante - HLMP-NS31 |
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