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HLMP-HM55-NPCXX Folha de dados(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-HM55-NPCXX Folha de dados(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED |
9 / 12 page 9 Precautions: Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • TheclosestLEDisallowedtosolderonboardis1.59mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. Notes: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to recalibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies' high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250 °C. Overstressing the LED during soldering process might cause premature failure to the LED due to delamination. Manual Solder Wave Soldering Dipping Pre-heat Temperature 105 °C Max. – Pre-heat Time 30 sec Max. – Peak Temperature 250 °C Max. 260 °C Max. Dwell Time 3 sec Max. 5 sec Max. Relative Light Output vs. Junction Temperature 0 1.0 TJ – JUNCTION TEMPERATURE – °C -40 1.2 0.8 -20 0 20 40 60 80 0.2 0.4 0.6 GREEN BLUE |
Nº de peça semelhante - HLMP-HM55-NPCXX |
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Descrição semelhante - HLMP-HM55-NPCXX |
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