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IRLL110PBF Folha de dados(PDF) 1 Page - International Rectifier |
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IRLL110PBF Folha de dados(HTML) 1 Page - International Rectifier |
1 / 8 page Parameter Max. Units ID @ Tc = 25°C Continuous Drain Current, VGS @ 5.0 V 1.5 ID @ Tc = 100°C Continuous Drain Current, VGS @ 5.0 V 0.93 IDM Pulsed Drain Current 12 PD @Tc = 25°C Power Dissipation 3.1 PD @TA = 25°C Power Dissipation (PCB Mount)** 2..0 W Linear Derating Factor 0.025 Linear Derating Factor (PCB Mount)** 0.017 W/°C VGS Gate-to-Source Voltage -/+10 V EAS Single Pulse Avalanche Energy 50 mJ IAR Avalanche Current 1.5 A EAR Repetitive Avalanche Energy 0.31 mJ dv/dt Peak Diode Recovery dv/dt 5.5 V/ns TJ, TSTG Junction and Storage Temperature Range -55 to + 150 °C IRLL110PbF HEXFET® Power MOSFET PD - 95222 S D G VDSS = 100V RDS(on) = 0.54Ω ID = 1.5A Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The SOT-223 package is designed for surface-mount using vapor phase, infra red, or wave soldering techniques. Its unique package design allows for easy automatic pick-and- place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of grreater than 1.25W is possible in a typical surface mount application. 04/27/04 Description l Surface Mount l Available in Tape & Reel l Dynamic dv/dt Rating l Repetitive Avalanche Rated l Logic-Level Gate Drive l RDS(on)Specified at VGS= 4V & 5V l Fast Switching l Lead-Free S O T -223 ** When mounted on 1'' square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994. Parameter Typ. Max. Units RθJC Junction-to-PCB ––– 40 RθJA Junction-to-Ambient. (PCB Mount)** ––– 60 Thermal Resistance °C/W Absolute Maximum Ratings A www.irf.com 1 Soldewring Temperature, for 10 seconds 300 (1.6mm from case) |
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