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74LVC3G34GM Folha de dados(PDF) 9 Page - NXP Semiconductors |
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74LVC3G34GM Folha de dados(HTML) 9 Page - NXP Semiconductors |
9 / 14 page 74LVC3G34_5 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 — 5 October 2007 9 of 14 NXP Semiconductors 74LVC3G34 Triple buffer Fig 10. Package outline SOT765-1 (VSSOP8) UNIT A1 A max. A2 A3 bp L HE Lp wy v ce D(1) E(2) Z(1) θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.00 0.85 0.60 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.1 8 ° 0 ° 0.13 0.1 0.2 0.4 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.40 0.15 Q 0.21 0.19 SOT765-1 MO-187 02-06-07 w M bp D Z e 0.12 14 8 5 θ A2 A1 Q Lp (A3) detail X A L HE E c v M A X A y 2.5 5 mm 0 scale VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 1 pin 1 index |
Nº de peça semelhante - 74LVC3G34GM |
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Descrição semelhante - 74LVC3G34GM |
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