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TLP781 Folha de dados(PDF) 5 Page - Toshiba Semiconductor |
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TLP781 Folha de dados(HTML) 5 Page - Toshiba Semiconductor |
5 / 15 page TLP781/TLP781F 2007-12-05 5 Specifications for Embossed-Tape Packing: (TP6), (TP7) 1. Applicable Package Package Name Product Type DIP4LF6 TLP781 DIP4LF7 TLP781F 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example 1) TLP781(BL-TP6) Tape type CTR rank Device name (Example 2) TLP781 F(BL-TP7) Tape type CTR rank Device name 3. Tape Dimensions 3.1 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Figure1 Device Orientation 3.2 Tape Packing Quantity:2000 devices per reel 3.3 Empty Device Recesses Are as Shown in Table 1. Table1 Empty Device Recesses Standard Remarks Occurrences of 2 or more successive empty device recesses 0 Within any given 40-mm section of tape, not including leader and trailer Single empty device recesses 6 devices (max.) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 30 or more empty holes. The end of the tape has 50 or more empty holes. Tape feed |
Nº de peça semelhante - TLP781 |
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Descrição semelhante - TLP781 |
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