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TA7259FG Folha de dados(PDF) 10 Page - Toshiba Semiconductor |
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TA7259FG Folha de dados(HTML) 10 Page - Toshiba Semiconductor |
10 / 18 page TA7259P/F/FG 2006-4-14 10 ⅱ ) The drive current path of the position sensing device should be connected to the GND independently. It should be separated especially from the output current path. If there is a plunge in position sensing device, insert the condenser (0.05~1µF) between + pin and – pin of each position sensing device. If there is a plunge in control input, insert the condenser (0.001∼0.1µF) between this pin and the GND. 図 3. ⅲ ) If upper oscillation (5MHz or more) is found, connect the condensers commonly from each coil output and then insert the condenser (C = 0.01∼0.1µF) between this connecting point and RF pin. (Fig.4−a) Aside from using a ringing absorbing condenser, consider a different method to connect the condenser between each coil output and RF pin. (Fig 4−b) 図 4-a 図 4-b ⅳ ) Make sure to take the power supply from VCC pin (“8” pin) directly. Design the circuit not to have the common impedance toward GND. Use of C2 (0.01∼0.1µF) is also effective. 図 5. TA7259P/F/FG TA7259 P/F/FG TA7259 P/F/FG Do not have common impedance with other circuits. Fig. 3 Fig. 4-a Fig. 4-b Fig. 5 |
Nº de peça semelhante - TA7259FG |
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Descrição semelhante - TA7259FG |
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