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TS985C6R Folha de dados(PDF) 7 Page - Fuji Electric |
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TS985C6R Folha de dados(HTML) 7 Page - Fuji Electric |
7 / 12 page MS5D3308 7/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. INSTALLATION ・Soldering involves temperatures which exceed the device storage temperature rating. To avoid device damage and to ensure reliability, observe the following guidelines from the quality assurance standard. Table 1: Solder temperature and duration Method Solder temperature Duration Number of times Reflow 260℃max. ≦10sec 2times ・Recommendation temperature profile(Reflow) ・Recommendation soldering pads Dimensions unit:mm 0 25 50 75 100 125 150 175 200 225 250 275 300 230℃ Post Cooling -5℃/sec(max.) 4.5℃/sec(max.) 260℃(peak) ≦10sec ≧50sec 6℃/sec(max.) Pre-heat 150∼180℃ 60∼120sec time [sec] |
Nº de peça semelhante - TS985C6R |
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Descrição semelhante - TS985C6R |
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