MS5D3308

7/12

H04-004-03a

Fuji Electric Device Technology Co.,Ltd.

INSTALLATION

・Soldering involves temperatures which exceed the device storage temperature rating. To avoid

device damage and to ensure reliability, observe the following guidelines from the quality

assurance standard.

Table 1: Solder temperature and duration

Method

Solder

temperature

Duration

Number of times

Reflow

260℃max.

≦10sec

2times

・Recommendation temperature profile(Reflow)

・Recommendation soldering pads

Dimensions unit:mm

0

25

50

75

100

125

150

175

200

225

250

275

300

230℃

Post Cooling

-5℃/sec(max.)

4.5℃/sec(max.)

260℃(peak)

≦10sec

≧50sec

6℃/sec(max.)

Pre-heat

150∼180℃

60∼120sec

time [sec]