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SMA661AS Folha de dados(PDF) 10 Page - STMicroelectronics |
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SMA661AS Folha de dados(HTML) 10 Page - STMicroelectronics |
10 / 14 page Package and packing informations SMA661AS 10/14 5 Package and packing informations 5.1 Package informations In order to meet environmental requirements, ST offers this device in ECOPACK® package. This package has a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 16. SOT666 (Lead-Free) package outline Table 6. SOT666 (Lead-free) mechanical data DIM. mm. MIN. TYP MAX. A 0.45 0.60 A3 0.08 018 b 0.17 0.27 b1 0.27 0.34 D 1.50 1.70 E 1.50 1.70 E1 1.10 1.30 e0.50 L1 0.19 L2 0.10 0.30 L3 0.10 E1 E L2 D A A3 b1 0.10 b M e A L1 L3 A |
Nº de peça semelhante - SMA661AS_07 |
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Descrição semelhante - SMA661AS_07 |
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