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FAN3100 Folha de dados(PDF) 2 Page - Fairchild Semiconductor |
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FAN3100 Folha de dados(HTML) 2 Page - Fairchild Semiconductor |
2 / 21 page © 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN3100 • Rev. 1.0.1 2 Ordering Information Part Number Input Threshold Package Packing Method Quantity / Reel FAN3100CMPX CMOS 6-Lead 2x2mm MLP Tape & Reel 3000 FAN3100CSX CMOS 5-Pin SOT23 Tape & Reel 3000 FAN3100TMPX TTL 6-Lead 2x2mm MLP Tape & Reel 3000 FAN3100TSX TTL 5-Pin SOT23 Tape & Reel 3000 All packages are lead free per JEDEC: J-STD-020B standard. Package Outlines 1 6 5 2 4 3 IN+ AGND VDD IN PGND OUT Figure 3. 2x2mm 6-Lead MLP (Top View) Figure 4. SOT23-5 (Top View) Thermal Characteristics (1) Package ΘJL (2) ΘJT (3) ΘJA (4) ΨJB (5) ΨJT (6) Units 6-Lead 2x2mm Molded Leadless Package (MLP) 2.7 133 58 2.8 42 °C/W SOT23-5 56 99 157 51 5 °C/W Notes: 1. Estimates derived from thermal simulation; actual values depend on the application. 2. Theta_JL ( ΘJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any thermal pad) that are typically soldered to a PCB. 3. Theta_JT ( ΘJT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is held at a uniform temperature by a top-side heatsink. 4. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow. The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate. 5. Psi_JB ( ΨJB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an application circuit board reference point for the thermal environment defined in Note 4. For the MLP-6 package, the board reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the SOT23-5 package, the board reference is defined as the PCB copper adjacent to pin 2. 6. Psi_JT ( ΨJT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and the center of the top of the package for the thermal environment defined in Note 4. |
Nº de peça semelhante - FAN3100_08 |
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Descrição semelhante - FAN3100_08 |
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