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MCZ33790EGR2 Folha de dados(PDF) 11 Page - Freescale Semiconductor, Inc |
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MCZ33790EGR2 Folha de dados(HTML) 11 Page - Freescale Semiconductor, Inc |
11 / 12 page Analog Integrated Circuit Device Data Freescale Semiconductor 11 33790 REVISION HISTORY REVISION HISTORY REVISION DATE DESCRIPTION OF CHANGES 7.0 5/2006 • Implemented Revision History page • Converted to Freescale format 8.0 11/2006 • Updated data sheet format • Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from Maximum Ratings on page 4. Added note with instructions to obtain this information from www.freescale.com. 9.0 11/2006 • Minor correction changes to Figure 1 and ordering information 10.0 12/2006 • Restated note Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. on page 4 11.0 3/2008 • Removed watermark from page 1. |
Nº de peça semelhante - MCZ33790EGR2 |
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Descrição semelhante - MCZ33790EGR2 |
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