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74LVT16244BEV Folha de dados(PDF) 1 Page - NXP Semiconductors

Nome de Peças 74LVT16244BEV
Descrição Electrónicos  3.3 V 16-bit buffer/driver; 3-state
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Fabricante Electrônico  NXP [NXP Semiconductors]
Página de início  http://www.nxp.com
Logo NXP - NXP Semiconductors

74LVT16244BEV Folha de dados(HTML) 1 Page - NXP Semiconductors

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1.
General description
The 74LVT16244B; 74LVTH16244B is a high-performance BiCMOS product designed for
VCC operation at 3.3 V.
This device is a 16-bit buffer and line driver featuring non-inverting 3-state bus outputs.
The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.
2.
Features
I 16-bit bus interface
I 3-state buffers
I Output capability: +64 mA and −32 mA
I TTL input and output switching levels
I Input and output interface capability to systems at 5 V supply
I Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs
I Power-up 3-state
I Live insertion and extraction permitted
I No bus current loading when output is tied to 5 V bus
I Latch-up protection
N JESD78 Class II exceeds 500 mA
I ESD protection:
N HBM JESD22-A114E exceeds 2000 V
N MM JESD22-A115-A exceeds 200 V
3.
Ordering information
74LVT16244B; 74LVTH16244B
3.3 V 16-bit buffer/driver; 3-state
Rev. 06 — 13 November 2008
Product data sheet
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVT16244BDL
−40 °C to +85 °C
SSOP48
plastic shrink small outline package; 48 leads;
body width 7.5 mm
SOT370-1
74LVTH16244BDL
74LVT16244BDGG
−40 °C to +85 °C
TSSOP48
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
SOT362-1
74LVTH16244BDGG
74LVT16244BEV
−40 °C to +85 °C
VFBGA56
plastic very thin fine-pitch ball grid array
package; 56 balls; body 4.5
× 7 × 0.65 mm
SOT702-1
74LVT16244BBQ
−40 °C to +125 °C
HUQFN60U plastic thermal enhanced ultra thin quad flat
package; no leads; 60 terminals; UTLP based;
body 4 x 6 x 0.55 mm
SOT1025-1
74LVTH16244BBQ


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