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LM193JG Folha de dados(PDF) 3 Page - Texas Instruments

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Nome de Peças LM193JG
Descrição Electrónicos  DUAL DIFFERENTIAL COMPARATORS
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Fabricante Electrônico  TI [Texas Instruments]
Página de início  http://www.ti.com
Logo TI - Texas Instruments

LM193JG Folha de dados(HTML) 3 Page - Texas Instruments

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LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005S − JUNE 1976 − REVISED OCTOBER 2004
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
symbol (each comparator)
IN+
IN−
OUT
schematic (each comparator)
80-
µA
Current Regulator
80
µA
60
µA
10
µA
VCC
10
µA
OUT
GND
IN+
IN−
Epi-FET
Diodes
Resistors
Transistors
Current values shown are nominal.
COMPONENT COUNT
1
2
2
30
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC (see Note 1)
36 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2)
±36 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (either input)
−0.3 V to 36 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage, VO
36 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, IO
20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short-circuit to ground (see Note 3)
Unlimited
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θJA (see Notes 4 and 5): D package
97
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGK package
172
°C/W
. . . . . . . . . . . . . . . . . . . . . . . .
P package
85
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
PS package
95
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package
149
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θJC (see Notes 6 and 7): FK package
5.61
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . .
JG package
14.5
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ
150
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case temperature for 60 seconds: FK package
260
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG package
300
°C
. . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
−65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. All voltage values, except differential voltages, are with respect to GND.
2. Differential voltages are at IN+, with respect to IN−.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
6. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) − TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
7. The package thermal impedance is calculated in accordance with MIL-STD-883.


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