Os motores de busca de Datasheet de Componentes eletrônicos
  Portuguese  ▼
ALLDATASHEETPT.COM

X  

74649-2503 Folha de dados(PDF) 1 Page - Molex Electronics Ltd.

Nome de Peças 74649-2503
Descrição Electrónicos  2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane Connector System
Download  2 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricante Electrônico  MOLEX [Molex Electronics Ltd.]
Página de início  http://www.molex.com
Logo MOLEX - Molex Electronics Ltd.

74649-2503 Folha de dados(HTML) 1 Page - Molex Electronics Ltd.

  74649-2503 Datasheet HTML 1Page - Molex Electronics Ltd. 74649-2503 Datasheet HTML 2Page - Molex Electronics Ltd.  
Zoom Inzoom in Zoom Outzoom out
 1 / 2 page
background image
FEATURES AND SPECIFICATIONS
2.00 by 2.25mm
(.079 by .089") Pitch
5-Row, 6-Row and 8-Row
VHDM-HSD
Module-to-Backplane
Connector System
Features and Benefits
s
Up to 5.0 Gbps bandwidth per signal pair enables
state-of-the-art system design and performance
s
2.00 by 2.25mm (.079 by .089”) pitch provides real
signal density of 10 differential pairs for 5-row and
6-row and 15 differential pairs for 8-row per
centimeter (25 and 38 pairs respectively per inch)
s
Minimum distance between daughtercards:
– 5-row system offers 15.00mm (.591")
– 6-row system offers 18.00mm (.709")
– 8-row system offers 22.00mm (.866")
s
Ground planes between signal columns provide
tightly controlled impedance for rise times down to
50 picoseconds (10-90%). This ensures very low
cross talk between signals within and between
columns
s
Ground pins are in the same grid as signal pins,
allowing wider channels for PCB routing and traces
up to 0.25mm (.010”) wide
s
6-row or 8-row VHDM-HSD wafers can be applied to
the same stiffener as standard VHDM® 6-row or 8-
row wafers. The combination of VHDM and VHDM-
HSD wafers, grouped together in the same stiffener,
provides cost effective solutions to different
performance parameters
The Very High Density Metric High Speed Differential
(VHDM-HSD) connector system has been expanded to
include 5-row, 6-row and 8-row daughtercard and
backplane modules. VHDM-HSD is designed for
differential-pair architecture applications that require
very high interconnect density and signal integrity in a
single-ended configuration.
The same great modularity features and components of
VHDM are provided in the VHDM-HSD. The 5-row and 6-
row systems feature 2 signal pairs per column and the
8-row system features 3 signal pairs per column in
increments of 10 and 25 columns. All circuits are
utilized as signal circuits without the need to use some as
ground circuits.
The daughtercard connector consists of a metal stiffener
just as with the VHDM system. The system combines the
signal wafers, power modules and guidance modules
into one continuous connector that can be ordered as a
single specific part number. The card pitch of the VHDM-
HSD 8-row system is the same as the standard VHDM 8-
row system, allowing both signal wafer types for single
ended and differential pair to be used together. This
modularity and design flexibility allow engineers to
incorporate both connector systems on the same
platforms. The system is based on a 2.00mm (.079")
pitch and includes vertical and right angle products that
can be configured up to 2000 circuits. The maximum
length of a daughtercard connector on a single stiffener
is 300mm (12").
The backplane connectors feature headers with open
ends for continuous side-to-side stacking and headers
with guide pins and polarizing keys on either end to aid
in proper alignment of the mating daughtercard. The
power modules occupy just a small width and hold
sequentially matable pins that each manage 10.0 amps
of current.
Molex offers application tooling for pressing VHDM-HSD
connectors into PCBs as separate modules or as complete
assemblies. VHDM-HSD cable assemblies are also
available for connecting backplane headers to high-
performance cables.
Note: VHDM and VHDM-HSD are trademarks or registered trademarks of Teradyne,Inc.


Nº de peça semelhante - 74649-2503

Fabricante ElectrônicoNome de PeçasFolha de dadosDescrição Electrónicos
logo
Molex Electronics Ltd.
74649-2503 MOLEX8-74649-2503 Datasheet
465Kb / 4P
   2.00mm (.079") Pitch 8-Row VHDM-HSD??Backplane Header, Open Module, 150 Circuits, Pin Length 4.25mm (.167")
More results


Html Pages

1 2


Folha de dados Download

Go To PDF Page


Ligação URL




Privacy Policy
ALLDATASHEETPT.COM
ALLDATASHEET é útil para você?  [ DONATE ] 

Sobre Alldatasheet   |   Publicidade   |   Contato conosco   |   Privacy Policy   |   roca de Link   |   Lista de Fabricantes
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com