TPA0213

2-W MONO AUDIO POWER AMPLIFIER

WITH HEADPHONE DRIVE

SLOS276B – JANUARY 2000 – REVISED MARCH 2000

10

POST OFFICE BOX 655303

MECHANICAL DATA

DGQ (S-PDSO-G10)

PowerPAD

™ PLASTIC SMALL-OUTLINE PACKAGE

0,69

0,41

0,25

Thermal Pad

(See Note D)

0,15 NOM

Gage Plane

4073273/A 04/98

4,98

0,17

6

3,05

4,78

2,95

10

5

3,05

2,95

1

0,27

0,15

0,05

1,07 MAX

Seating Plane

0,10

0,50

M

0,25

0

°–6°

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.

This pad is electrically and thermally connected to the backside of the die and possibly selected leads. The dimension of the thermal

pad is 1.40 mm (height as illustrated)

× 1.80 (width as illustrated) mm (maximum). The pad is centered on the bottom of the package.

PowerPAD is a trademark of Texas Instruments Incorporated.