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LA79B-1-G.SE.G.DBK-S2-PF Folha de dados(PDF) 8 Page - LIGITEK electronics co., ltd. |
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LA79B-1-G.SE.G.DBK-S2-PF Folha de dados(HTML) 8 Page - LIGITEK electronics co., ltd. |
8 / 8 page 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Thermal Shock Test Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to see soldering well performed or not. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202:103B JIS C 7021: B-11 The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Operating Life Test Low Temperature Storage Test High Temperature Storage Test Test Condition Test Item Reliability Test: MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Description Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/7 PART NO. LA79B-1/G.SE.G.DBK-S2-PF |
Nº de peça semelhante - LA79B-1-G.SE.G.DBK-S2-PF |
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Descrição semelhante - LA79B-1-G.SE.G.DBK-S2-PF |
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