SAMWHA ELECTRONICS CO., LTD

Reliability & Test Condition

http://www.samwha.com/chip

This description in the this catalogue is subject to change without notice

Temperature : 125

± 3 ℃

Applied current : rated current

Time : 1000

± 12 hours

Measurement at room ambient

temperature after placing for 24 hours

High temperature

load resistance

Temperature : 40

± 2 ℃

Humidity : 90

± 2 % RH

Time : 500

± 12 hours

Measurement at room ambient

temperature after placing for 24 hours

Humidity

resistance

Preheat temperature : 150 ℃

Preheat time : 60 sec.

Solder temperature : 245

± 5 ℃

Soldering time : 10 sec. max.

(Reflow soldering profile)

More than 50% of the terminal electrode

shall be covered with new solder

Reflow soldering

at packing condition

40 ℃ max., 70% RH max.

Storage

temperature range

Preheat temperature : 100 ~ 150 ℃

Preheat time : 60 sec.

Solder temperature : 245

± 5 ℃

Soldering time : 10

± 1 sec.

More than 90% of the terminal electrode shall be

covered with new solder

Solderability

Preheat temperature : 100 ~ 150 ℃

Preheat time : 60 sec.

Solder temperature : 270

± 10 ℃

Soldering time : 10

± 0.5 sec.

1. No damage such as cracks should be

caused in chip element

2. More than 75% of the terminal electrode

shall be covered with new solder

3. Impedance shall not change

more than ±30 %

Resistance to

soldering heat

Temperature : 125

± 3 ℃

Time : 500

± 12 hours

Measurement at room ambient

temperature after placing for 24 hours

1. No mechanical damage

2. Impedance shall not change more than ±30 %

High temperature

resistance

-

- 55 ℃ ~ + 125 ℃

Operating

temperature range

Test Conditions

Requirements

Item

ST ≥

CT

1

2

CT

ST

DPS-081104

CHIP BEADS