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TS2596S Folha de dados(PDF) 5 Page - Taiwan Semiconductor Company, Ltd

Nome de Peças TS2596S
Descrição Electrónicos  2A / 150KHz Buck Dc-Dc Converter
Download  9 Pages
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Fabricante Electrônico  TSC [Taiwan Semiconductor Company, Ltd]
Página de início  http://www.taiwansemi.com
Logo TSC - Taiwan Semiconductor Company, Ltd

TS2596S Folha de dados(HTML) 5 Page - Taiwan Semiconductor Company, Ltd

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TS2596S
2A / 150KHz Buck Dc-Dc Converter
5/9
Version: B07
Function Description
Pin Function
Vcc
This is the positive input supply for the IC switching regulator. A suitable input bypass capacitor must be presented at
this pin to minimize voltage transients and to supply the switching currents needed by the regulator.
Ground
Circuit ground
SW Output
Internal switch. The voltage at this pin switches between (+Vcc – Vsat) and approximately – 0.5V, with a duty cycle of
approximately Vout / Vcc. To minimize coupling to sensitive circuitry, the PC board copper area connected to this pin
should be minimized.
Feedback
Sense the regulated output voltage to complete the feedback loop.
Enable
Allows the switching regulator circuit to be shutdown using logic level signals thus dropping the total input supply
current to approximately 100uA. Pulling this pin below a threshold voltage of approximately 1.3V turns the regulator on,
and pulling this pin above 1.3V (up to a maximum of Vcc) shuts the regulator down. If this shutdown feature is not
needed, the EN pin can be wired to the ground pin.
Thermal Considerations
The SOP-8 package needs a heat sink under most conditions. The size of the heat sink depends on the input voltage,
the output voltage, the load current and the ambient temperature. The TS2596S junction temperature rises above
ambient temperature for a 2A load and different input and output voltages.
The data for these curves was taken with the TS2596S (SOP-8) package operating as a buck-switching regulator in an
ambient temperature of 25ºC (still air). These temperature increments are all approximate and are affected by many
factors. Higher ambient temperatures requires more heat sinker.
For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper (need
connect to the Ground pin) should be used in the board layout, (one exception is the SW pin, which should not have
large areas of copper.) Large areas of copper provide the best transfer of heat (lower thermal resistance) to the
surrounding air, and moving air lowers the thermal resistance even further.
Package thermal resistance and junction temperature increments are all approximate. The increments are affected by
a lot of factors. Some of these factors include board size, shape, thickness, position, location, and even board
temperature. Other factors are, trace width, total printed circuit copper area, copper thickness, single or double-sided,
multi-layer board and the amount of solder on the board.
The effectiveness of the PC board to dissipate heat also depends on the size, quantity and spacing of other
components on the board, as well as whether the surrounding air is still or moving. Furthermore, some of these
components such as the catch diode will add heat to the PC board and the heat can vary as the input voltage changes.
For the inductor, depending on the physical size, type of core material and the DC resistance, it could either act as a
heat sink taking heat away from the board, or it could add heat to the board.


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