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BU1511KV2 Folha de dados(PDF) 1 Page - Rohm

Nome de Peças BU1511KV2
Descrição Electrónicos  Silicon monolithic integrated circuit
Download  5 Pages
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Fabricante Electrônico  ROHM [Rohm]
Página de início  http://www.rohm.com
Logo ROHM - Rohm

BU1511KV2 Folha de dados(HTML) 1 Page - Rohm

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REV.C
Structure
Silicon monolithic integrated circuit
Product Name
System LSI for Event data recorder
Type
BU1511KV2
Function
BU1511KV2 is a system LSI for event data recorder that makes developing it easier
BU1511KV2 have built-in specific hardware to communicate and control with a 3-axis
accelerometer and a camera module, SD card, etc. that are recommended for event data
recorder.
The specific hardware are controllerable by built-in ARM946E-S, which can execute various
applications.
The following function blocks are built-in.
・ARM946E-S
・Interrupt Controller
・External Memory Interface
・Timer/Timer Counter
・GPIO(16ch, PWM 4ch(shared), IRQ 4ch(shared))
・UART(2ch)
・SD Card Interface/SD Card Controller
・I2C Master Controller
・SSI(Synchronous Serial Interface)
・Camera Interface (up to 2M pixels)
・Watch Dog Timer
・JPEG Codec
・ADPCM Audio Codec with IIS Interface
・Clock Controller/PLL
・TV Encoder(within 75
Ω driver)
・A/D Converter(4ch)
Absolute maximum ratings
Parameter
Symbol
Rating
Unit
Parameter
Symbol
Rating
Unit
Power supply voltage 1 (DAC)
DAVDD
-0.3~+4.2
V
Input voltage(ADC)
VIN1
-0.3~ADVDD+0.3
V
Power supply voltage 2 (ADC)
ADVDD
-0.3~+4.2
V
Input voltage(I2C-1)
VIN2
-0.3~I1VDD+0.3
V
Power supply voltage 3 (I2C-1)
I1VDD
-0.3~+4.2
V
Input voltage(I2C-2)
VIN3
-0.3~I2VDD+0.3
V
Power supply voltage 4 (I2C-2)
I2VDD
-0.3~+4.2
V
Input voltage(SD-CARD)
VIN4
-0.3~SDVDD+0.3
V
Power supply voltage 5 (SD-CARD)
SDVDD
-0.3~+4.2
V
Input voltage(CAMERA)
VIN5
-0.3~CAVDD+0.3
V
Power supply voltage 6(CAMERA)
CAVDD
-0.3~+4.2
V
Input voltage(Other IO)
VIN6
-0.3~IOVDD+0.3
V
Power supply voltage 7(Other IO)
IOVDD
-0.3~+4.2
V
Storage temperature range
Tstg
-40~+150
ºC
Power supply voltage 8(Digital CORE)
DVDD
-0.3~+2.1
V
Power dissipation
PD
1200*1, 1700*2
mW
*1
IC only. In the case of exceeding 25
C, 12.0 mW should be reduced at the rating 1C.
*2
When packaging a glass epoxy board of 270x70x1.6mm. If exceeding 25ºC, 17mW should be reduced at the rating 1ºC.
*
Has not been designed to withstand radiation.
Because this product is specifically designed for a particular device or unit, check in advance if the device or unit is a strategic material stated in the Foreign
Exchange law.
Be careful of handling this document because contents of this document may fall under the service (technology in the design, the manufacture and the use)
defined in the Foreign Exchange and Foreign Trade Control law of Japan.


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