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BD9778HFP Folha de dados(PDF) 14 Page - Rohm |
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BD9778HFP Folha de dados(HTML) 14 Page - Rohm |
14 / 17 page 14/16 Technical Note Fig.36 Equivalent circuit Fig.37 Typical simple construction of monolithic IC P layer E B C (Pin B) Transistor (NPN) P N N N N GND Parasitic element GND P+ P+ (Pin A) GND Parasitic element (PIN B) GND B E C Parasitic element P+ P layer (Pin A) Resistor P N N N GND Parasitic element P+ Notes for use 1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. Furthermore, don't turn on the IC with a fast rising edge of VIN. ( rise time << 10V / µsec ) 2) GND potential GND potential should maintain at the minimum ground voltage level. Furthermore, no terminals should be lower than the GND potential voltage including an electric transients. 3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins are shorted together or are shorted to other circuits power lines. 5) Operation in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 6) Inspection with set printed circuit board When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or removing it from a jig or fixture, during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting and storing the IC. VIN EN/SYNC 222 k Ω 221 k Ω 2k Ω VREGA 139 k Ω 145 k Ω SW SW EN VIN 10k Ω 300k Ω 250k Ω VIN 2k Ω 300k Ω 50k Ω RT VIN VREF VIN EN/SYNC BD9781HFP EN BD9778F/HFP, BD9001F 1k Ω VIN FB VREF 1k Ω INV VIN VREF FB BD9778F/HFP, BD9781HFP INV RT FB BD9001F 1k Ω VIN FB VREF 1k Ω 2010.02 - Rev. B www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. BD9778F, BD9778HFP, BD9001F, BD9781HFP |
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