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ADP1650ACBZ-R7 Folha de dados(PDF) 6 Page - Analog Devices

Nome de Peças ADP1650ACBZ-R7
Descrição Electrónicos  1.5 A LED Flash Driver with I2C-Compatible Interface
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Fabricante Electrônico  AD [Analog Devices]
Página de início  http://www.analog.com
Logo AD - Analog Devices

ADP1650ACBZ-R7 Folha de dados(HTML) 6 Page - Analog Devices

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ADP1650
Rev. 0 | Page 6 of 32
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
VIN, SDA, SCL, EN, GPIO1, GPIO2,
STROBE, LED_OUT, SW, VOUT to GND
−0.3 V to +6 V
PGND to SGND
−0.3 V to +0.3 V
Ambient Temperature Range (TA)
−40°C to +85°C
Junction Temperature Range (TJ)
−40°C to +125°C
Storage Temperature
JEDEC J-STD-020
ESD Human Body Model
±2000 V
ESD Charged Device Model
±500 V
ESD Machine Model
±150 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
The ADP1650 may be damaged if the junction temperature
limits are exceeded. Monitoring TA does not guarantee that TJ
is within the specified temperature limits. In applications with
high power dissipation and poor thermal resistance, the maximum
TA may have to be derated. In applications with moderate power
dissipation and low PCB thermal resistance, the maximum TA
can exceed the maximum limit as long as the TJ is within speci-
fication limits. TJ of the device is dependent on the TA, the power
dissipation (PD) of the device, and the junction-to-ambient
thermal resistance (θJA) of the package. Maximum TJ is
calculated from the TA and PD using the following formula:
TJ = TA + (PD × θJA)
THERMAL RESISTANCE
θJA of the package is based on modeling and calculation using
a 4-layer board. θJA is highly dependent on the application and
board layout. In applications where high maximum power dissi-
pation exists, attention to thermal board design is required. The
value of θJA may vary, depending on PCB material, layout, and
environmental conditions. The specified value of θJA is based
on a 4-layer, 4 in × 3 in, 2 1/2 oz copper board, per JEDEC
standards. For more information, see the AN-617 Application
Note, MicroCSPTM
Wafer Level Chip Scale Package.
θJA is specified for a device mounted on a JEDEC 2S2P PCB.
Table 5. Thermal Resistance
Package Type
θJA
Unit
12-Ball WLCSP
75
°C/W
ESD CAUTION


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