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SI8221 Folha de dados(PDF) 9 Page - Silicon Laboratories |
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SI8221 Folha de dados(HTML) 9 Page - Silicon Laboratories |
9 / 28 page Si8220/21 Rev. 0.22 9 Figure 3. (WB SOIC-16) Thermal Derating Curve, Dependence of Safety Limiting Values with Case Temperature per DIN EN 60747-5-2 Table 6. IEC Safety Limiting Values1 Parameter Symbol Test Condition Min Typ Max Unit WB SOIC-16 NB SOIC-8 Case Temperature TS — — 150 150 °C Safety input, output, or supply current IS JA = 140 °C/W (NB SOIC-8), 100 °C (WB SOIC-16), VI =5.5 V, TJ =150 °C, TA =25°C —— 50 40 mA Device Power Dissipation2 PD —— 1.2 1.2 W Notes: 1. Maximum value allowed in the event of a failure; also see the thermal derating curve in Figure 4. 2. The Si822x is tested with VO =24V, TJ =150 ºC, CL = 200 pF, input a 2 MHz 50% duty cycle square wave. Table 7. Thermal Characteristics Parameter Symbol Min Typ Max Unit WB SOIC-16 NB SOIC-8 IC Junction-to-Air Thermal Resis- tance JA — 100 140 — ºC/W 0 200 150 100 50 60 40 20 0 Case Temperature (ºC) VDDI = 5.5 V VDDA, VDDB = 24 V 10 30 50 |
Nº de peça semelhante - SI8221 |
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Descrição semelhante - SI8221 |
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