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AMIS30621C6217RG Folha de dados(PDF) 5 Page - ON Semiconductor |
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AMIS30621C6217RG Folha de dados(HTML) 5 Page - ON Semiconductor |
5 / 59 page AMIS−30621 http://onsemi.com 5 PACKAGE THERMAL RESISTANCE The AMIS−30621 is available in SOIC−20 and optimized NQFP32 packages. For cooling optimizations, the NQFP has an exposed thermal pad which has to be soldered to the PCB ground plane. The ground plane needs thermal vias to conduct the head to the bottom layer. Figures 3 and 4 give examples for good power distribution solutions. For precise thermal cooling calculations the major thermal resistances of the devices are given. The thermal media to which the power of the devices has to be given are: • Static environmental air (via the case) • PCB board copper area (via the device pins and exposed pad) The thermal resistances are presented in Table 5: DC Parameters. The major thermal resistances of the device are the Rth from the junction to the ambient (Rthja) and the overall Rth from the junction to the leads (Rthjp). The NQFP device is designed to provide superior thermal performance. Using an exposed die pad on the bottom surface of the package, is mainly contributing to this performance. In order to take full advantage of the exposed pad, it is most important that the PCB has features to conduct heat away from the package. A thermal grounded pad with thermal vias can achieve this. In below table, one can find the values for the Rthja and Rthjp, simulated according to the JESD−51standard: Package Rth Junction−to−Leads and Exposed Pad (Rthjp) Rth Junction−to−Leads (Rthjp) Rth Junction−to−Ambient Rthja 1S0P Rth Junction−to−Ambient Rthja 2S2P SOIC−20 19 62 39 NQFP−32 0.95 60 30 The Rthja for 2S2P is simulated conform to JESD−51 as follows: • A 4−layer printed circuit board with inner power planes and outer (top and bottom) signal layers is used • Board thickness is 1.46 mm (FR4 PCB material) • The 2 signal layers: 70 mm thick copper with an area of 5500 mm2 copper and 20% conductivity • The 2 power internal planes: 36 mm thick copper with an area of 5500 mm2 copper and 90% conductivity The Rthja for 1S0P is simulated conform to JESD−51 as follows: • A 1−layer printed circuit board with only 1 layer • Board thickness is 1.46 mm (FR4 PCB material) • The layer has a thickness of 70 mm copper with an area of 5500 mm2 copper and 20% conductivity NQFP−32 Figure 3. Example of SOIC−20 PCB Ground Plane Layout (Preferred Layout at Top and Bottom) Figure 4. Example of NQFP−32 PCB Ground Plane Layout (Preferred Layout at Top and Bottom) |
Nº de peça semelhante - AMIS30621C6217RG |
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Descrição semelhante - AMIS30621C6217RG |
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