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SL2S2102FTB Folha de dados(PDF) 3 Page - NXP Semiconductors

Nome de Peças SL2S2102FTB
Descrição Electrónicos  ICODE SLIX a product family of smart label ICs
Download  13 Pages
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Fabricante Electrônico  NXP [NXP Semiconductors]
Página de início  http://www.nxp.com
Logo NXP - NXP Semiconductors

SL2S2102FTB Folha de dados(HTML) 3 Page - NXP Semiconductors

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SL2S2002_SL2S2102_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 10 January 2011
198332
3 of 13
NXP Semiconductors
SL2S2002; SL2S2102
ICODE SLIX
4.
Quick reference data
[1]
Bandwidth limitation (
± 7 kHz) according to ISM band regulations.
[2]
Measured with an HP4285A LCR meter at 13.56 MHz and 2 V RMS.
5.
Ordering information
Table 1.
Quick reference data
Typical ratings are not guaranteed. The values listed are at room temperature.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Wafer EEPROM characteristics
tret
retention time
Tamb ≤ 55 °C
50
--year
Nendu(W)
write endurance
100000
-
-
cycle
Interface characteristics
fi
input frequency
[1] 13.553
13.56
13.567
MHz
Ci
input capacitance
between LA and LB
[2]
SL2S2002FUD
SL2S2002FTB
22.3
23.5
24.7
pF
SL2S2102FUD
SL2S2102FTB
92
97
102
pF
Table 2.
Ordering information
Type number
Package
Version
Name
Description
SL2S2002FUD
wafer
sawn, bumped wafer, 120
μm, on film frame carrier,
Ci between LA and LB = 23.5 pF (typical)
-
SL2S2102FUD
wafer
sawn, bumped wafer, 120
μm, on film frame carrier,
Ci between LA and LB = 97 pF (typical)
-
SL2S2002FTB
XSON3
plastic extremely thin small outline package; no leads;
3 terminals; body 1 x 1.45 x 0.5 mm;
Ci between LA and LB = 23.5 pF (typical)
SOT1122
SL2S2102FTB
XSON3
plastic extremely thin small outline package; no leads;
3 terminals; body 1 x 1.45 x 0.5 mm;
Ci between LA and LB = 97 pF (typical)
SOT1122


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