FAN5355MP00X datasheet(4/26 Pages) FAIRCHILD

Nome de Peças	FAN5355MP00X

Descrição Electrónicos	1A / 0.8A, 3MHz Digitally Programmable Regulator

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Fabricante Electrônico	FAIRCHILD [Fairchild Semiconductor]

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FAN5355 • Rev. 1.0.6

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above

the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended

exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings

are stress ratings only.

Symbol

Parameter

Min.

Max.

Units

VCC

AVIN, SW, PVIN Pins

-0.3

6.5

V

Other Pins

-0.3

AVIN + 0.3

(6)

V

ESD

Electrostatic Discharge Protection Level

Human Body Model per JESD22-A114

3.5

KV

Charged Device Model per JESD22-C101

1.5

KV

TJ

Junction Temperature

–40

+150

°C

TSTG

Storage Temperature

–65

+150

°C

TL

Lead Soldering Temperature, 10 Seconds

+260

°C

Note:

6.

Lesser of 6.5V or AVIN+0.3V.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating

conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding

them or designing to absolute maximum ratings.

Symbol

Parameter

Min.

Max.

Units

VIN

Supply Voltage

2.7

5.5

V

f

Frequency Range

2.7

3.3

MHz

VCCIO

SDA and SCL Voltage Swing

(7)

2.5

V

TA

Ambient Temperature

–40

+85

°C

TJ

Junction Temperature

–40

+125

°C

Note:

7.

The I

2C interface operates with tHD;DAT = 0 as long as the pull-up voltage for SDA and SCL is less than 2.5V. If voltage

swings greater than 2.5V are required (for example if the I

2C bus is pulled up to VIN), the minimum tHD;DAT must be

increased to 80ns. Most I

2C masters change SDA near the midpoint between the falling and rising edges of SCL, which

provides ample tHD;DAT .

Dissipation Ratings(8)

Package

RθJA

(9)

Power Rating at TA ≤ 25°C

Derating Factor > TA = 25ºC

Molded Leadless Package (MLP)

49ºC/W

2050mW

21mW/ºC

Wafer-Level Chip-Scale Package (WLCSP)

110ºC/W

900mW

9mW/ºC

Notes:

8.

Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any

allowable ambient temperature is PD = [TJ(max) - TA ] / θJA.

9.

This thermal data is measured with high-K board (four-layer board according to JESD51-7 JEDEC standard).

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