LA4425A

PS No.3309-9/9

SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using

products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition

ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd.

products described or contained herein.

SANYO Semiconductor Co.,Ltd. strives to supply high-quality high-reliability products, however, any and all

semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or

malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise

to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt

safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not

limited to protective circuits and error prevention circuits for safe design, redundant design, and structural

design.

Upon using the technical information or products described herein, neither warranty nor license shall be granted

with regard to intellectual property rights or any other rights of SANYO Semiconductor Co.,Ltd. or any third

party. SANYO Semiconductor Co.,Ltd. shall not be liable for any claim or suits with regard to a third party's

intellctual property rights which has resulted from the use of the technical information and products mentioned

above.

Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed

for volume production.

Any and all information described or contained herein are subject to change without notice due to

product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the

SANYO Semiconductor Co.,Ltd. product that you intend to use.

In the event that any or all SANYO Semiconductor Co.,Ltd. products described or contained herein are

controlled under any of applicable local export control laws and regulations, such products may require the

export license from the authorities concerned in accordance with the above law.

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without the prior written consent of SANYO Semiconductor Co.,Ltd.

T.S.D is capable of starting operation at Tc 120 to 130

°C. When this is converted to junction temperature (Tj) according to

the formula below.

Tj

≈ 165C,

Tj = Qjc.Pd + Tc

As T.S.D operation progresses, the output pin bias voltage drops, and it becomes harder to drive the upper waveform.

Therefore, the current (ICC) and power (PO) show a tendency to decrease.

Proper Cares in Mounting Radiator Fin

1. The mounting torque is in the range of 1. The mounting torque is in the range of 39 to 59 N.cm.

2. The distance between screw holes of the radiator fin must coincide with the distance between screw holes of the IC.

3. The screw to be used must have a head equivalent to the one of truss machine screw or binder machine screw defined

by JIS. Washers must be also used to protect the IC case.

4. No foreign matter such as cutting particles shall exist between heat sink and radiator fin. When applying grease on

the junction surface, it must be applied uniformly on the whole surface.

5. Because the heat sink mounting tab and the heat sink are at the same electric potential as the chip’s GND, care must

be taken when mounting the heat sink on more than one device.

6. IC lead pins are soldered to the printed circuit board after the radiator fin is mounted on the IC.

This catalog provides information as of May, 2007. Specifications and information herein are subject

to change without notice.