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AD7944 Folha de dados(PDF) 9 Page - Analog Devices |
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AD7944 Folha de dados(HTML) 9 Page - Analog Devices |
9 / 28 page ADA4896-2/ADA4897-1 Rev. 0 | Page 9 of 28 ABSOLUTE MAXIMUM RATINGS The quiescent power is the voltage between the supply pins (VS) multiplied by the quiescent current (IS). Table 6. Parameter Rating Supply Voltage 11 V Power Dissipation See Figure 3 Common-Mode Input Voltage −VS − 0.7 V to +VS + 0.7 V Differential Input Voltage ±0.7 V Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +125°C Lead Temperature (Soldering 10 sec) 300°C Junction Temperature 150°C PD = Quiescent Power + (Total Drive Power – Load Power) () L 2 OUT L OUT S S S D R V – R V 2 V I V P ⎟⎟ ⎠ ⎞ ⎜⎜ ⎝ ⎛ × + × = RMS output voltages should be considered. If RL is referenced to −VS, as in single-supply operation, the total drive power is VS × IOUT. If the rms signal levels are indeterminate, consider the worst case, when VOUT = VS/4 for RL to midsupply. () ( ) L S S S D R V I V P 2 4 / + × = Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. In single-supply operation with RL referenced to −VS, worst case is VOUT = VS/2. Airflow increases heat dissipation, effectively reducing θJA. Also, more metal directly in contact with the package leads and exposed paddle from metal traces, through holes, ground, and power planes, reduces θJA. THERMAL RESISTANCE Figure 3 shows the maximum safe power dissipation in the package vs. the ambient temperature for the dual 8-lead LFCSP (61°C/W), the dual 8-lead MSOP (222°C/W), the single 8-lead SOIC (133°C/W), and the single 6-lead SOT-23 (306°C/W) on a JEDEC standard 4-layer board. θJA values are approximations. θJA is specified for the worst-case conditions, that is, θJA is specified for a device soldered in a circuit board for surface- mount packages. Table 7 lists the θJA for the ADA4896-2/ ADA4897-1. Table 7. Thermal Resistance 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 –45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85 95 105 115 125 AMBIENT TEMPERAURE (°C) 6-LEAD SOT-23 8-LEAD MSOP 8-LEAD SOIC 8-LEAD LFCSP TJ = 150°C Package Type θJA Unit 8-Lead Dual MSOP (ADA4896-2) 222 °C/W 8-Lead Dual LFCSP (ADA4896-2) 61 °C/W 8-Lead Single SOIC (ADA4897-1) 133 °C/W 6-Lead Single SOT-23 (ADA4897-1) 306 °C/W MAXIMUM POWER DISSIPATION The maximum safe power dissipation for the ADA4896-2/ ADA4897-1 is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the properties of the plastic change. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, perma- nently shifting the parametric performance of the ADA4896-2/ ADA4897-1. Exceeding a junction temperature of 175°C for an extended period of time can result in changes in silicon devices, potentially causing degradation or loss of functionality. The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the die due to the ADA4896-2/ADA4897-1 drive at the output. Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board ESD CAUTION |
Nº de peça semelhante - AD7944 |
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Descrição semelhante - AD7944 |
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