TC62D748AFG/AFNAG/BFNAG

2010-03-05

6

Characteristics

Symbol

Rating *1

Unit

Pow e r

su pply

volt age

V

Outpu t

curr ent

95

mA

Logic

in put

volt age

V

Outpu t

vo lt age

V

Operating

temperature

°C

S t orage

temperat ure

°C

Ther mal

resist ance

Rth(j-a)

94 (AFG) *3, 80.07(AFNAG/BFNAG)

When mounted PCB

°C/W

Pow e r

di ss ip a t ion

1.32 (AFG) *3, 1.56(AFNAG/BFNAG)

When mounted PCB

W

Note1: Voltage is ground referenced.

Note2: Do not exceed 6.0V.

Note3: PCB condition 76.2 x 114.3 x 1.6 mm, Cu 30% (SEMI conforming)

Note4: The power dissipation decreases the reciprocal of the saturated thermal resistance (1/ Rth(j-a)) for each

degree (1°C) that the ambient temperature is exceeded (Ta = 25°C).

Operating Conditions

Characteristics

Symbol

Test Conditions

Min

Typ.

Max

Unit

Pow e r

su pply

volt age

⎯

3.0

⎯

5.5

V

High level logic input voltage

SIN,SCK, SLAT , OE

0.7

×

⎯

V

Low le ve l lo gi c inp u t vo l t age

SIN,SCK, SLAT , OE

GND

⎯

0.3

×

V

High level SOUT output current

⎯

⎯

⎯

mA

Low level SOUT output current

⎯

⎯

⎯

1

mA

Const a nt curre nt ou tput

OUTn

1.5

⎯

90

mA

Characteristics

Symbol

Test

Circuits

Test Conditions

Min

Typ.

Max

Unit

Serial data tr ansfer freque ncy

6

⎯

⎯

⎯

25

MHz

6

⎯

5

⎯

⎯

ns

Hol

d

t

i

me

6

⎯

5

⎯

⎯

ns

6

⎯

5

⎯

⎯

ns

Setup

time

6

⎯

5

⎯

⎯

ns

Maximum clock rise t i me

6

*1

⎯

⎯

500

ns

Maximum clock fa ll t i me

6

*1

⎯

⎯

500

ns

Note1: If the device is connected in a cascade and the tr/tf of the clock waveform increases due to deceleration of the clock

waveform,it may not be possible to achieve the timing required for data transfer. Please keep these timing conditions in mind

when designing your application.