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TMP709 Folha de dados(PDF) 2 Page - Texas Instruments |
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TMP709 Folha de dados(HTML) 2 Page - Texas Instruments |
2 / 14 page TMP709 SBOS583A – DECEMBER 2011 – REVISED FEBRUARY 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PACKAGE PRODUCT PACKAGE-LEAD DESIGNATOR PACKAGE MARKING ORDERING NUMBER TMP709AIDBVR TMP709 SOT23-5 DBV SBJ TMP709AIDBVT (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) TMP709 UNIT Supply voltage range (VCC) –0.3 to 6 V Input voltage range (SET and HYST) –0.3 to (VCC + 0.3) V Output voltage range (OT) –0.3 to 6 V Input current 20 mA Output current 20 mA Operating temperature, TA –40 to +125 °C Storage temperature, Tstg –65 to +150 °C Junction temperature, TJ +150 °C Human body model (HBM) 4000 V ESD ratings Charged device model (CDM) 1000 V Machine model (MM) 200 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. THERMAL INFORMATION TMP709 THERMAL METRIC(1) DBV (SOT23) UNITS 5 PINS θJA Junction-to-ambient thermal resistance 217.9 θJCtop Junction-to-case (top) thermal resistance 86.3 θJB Junction-to-board thermal resistance 44.6 °C/W ψJT Junction-to-top characterization parameter 4.4 ψJB Junction-to-board characterization parameter 43.8 θJCbot Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TMP709 |
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