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ULN2003LVDR Folha de dados(PDF) 2 Page - Texas Instruments |
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ULN2003LVDR Folha de dados(HTML) 2 Page - Texas Instruments |
2 / 19 page ULN2003LV SLRS059A – APRIL 2012 – REVISED APRIL 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) TA PART NUMBER PACKAGE TOP-SIDE MARKING ULN2003LVDR 16-Pin SOIC Reel of 2500 UN2003LV –40°C to 85°C ULN2003LVPWR 16-Pin TSSOP Reel of 2000 UN2003LV (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Specified at TJ = –40°C to 125°C unless otherwise noted. VALUE UNIT MIN MAX VIN Pins IN1- IN7 to GND voltage –0.3 5.5 V VOUT Pins OUT1 – OUT7 to GND voltage 8 V VCOM Pin COM to GND voltage 8 V Max GND-pin continuous current (TJ > +125°C) 700 mA IGND Max GND-pin continuous current (TJ < +100°C) 1.0 A 16 Pin - SOIC 0.58 W PD Total device power dissipation at TA = 85°C 16 Pin -TSSOP 0.45 W ESD Rating – HBM 2 kV ESD ESD Rating – CDM 500 V TA Operating free-air ambient temperature range –40 85 °C TJ Operating virtual junction temperature –55 150 °C Tstg Storage temperature range –55 150 °C (1) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS (1) (2) BOARD PACKAGE θJC θJA (3) DERATING TA < 25°C TA = 70°C TA = 85°C FACTOR ABOVE TA = 25ºC High-K 16-Pin SOIC 69°C/W 112°C/W 8.88 mW/ºC 1.11 W 0.71 W 0.58 W High-K 16-Pin TSSOP 74°C/W 142°C/W 7.11 mW/ºC 0.88 W 0.56 W 0.45 W (1) Maximum dissipation values for retaining device junction temperature of 150°C (2) Refer to TI’s design support web page at www.ti.com/thermal for improving device thermal performance (3) Operating at the absolute TJ-max of 150°C can affect reliability– for higher reliability it is recommended to ensure TJ < 125°C 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): ULN2003LV |
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