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AD8137YRZ-REEL7 Folha de dados(PDF) 9 Page - Aavid, Thermal Division of Boyd Corporation |
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AD8137YRZ-REEL7 Folha de dados(HTML) 9 Page - Aavid, Thermal Division of Boyd Corporation |
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9 / 32 page  Data Sheet AD8137 Rev. E | Page 9 of 32 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating Supply Voltage 12 V VOCM VS+ to VS− Power Dissipation See Figure 3 Input Common-Mode Voltage VS+ to VS− Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +125°C Lead Temperature (Soldering, 10 sec) 300°C Junction Temperature 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, θJA is specified for the device soldered in a circuit board in still air. Table 5. Thermal Resistance Package Type θJA θJC Unit 8-Lead SOIC/2-Layer 157 56 °C/W 8-Lead SOIC/4-Layer 125 56 °C/W 8-Lead LFCSP/4-Layer 70 56 °C/W MAXIMUM POWER DISSIPATION The maximum safe power dissipation in the AD8137 package is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the parametric performance of the AD8137. Exceeding a junction temperature of 175°C for an extended period can result in changes in the silicon devices, potentially causing failure. The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the package due to the load drive for all outputs. The quiescent power is the voltage between the supply pins (VS) times the quiescent current (IS). The load current consists of differential and common-mode currents flowing to the load, as well as currents flowing through the external feedback networks and the internal common-mode feedback loop. The internal resistor tap used in the common-mode feedback loop places a 1 kΩ differential load on the output. RMS output voltages should be considered when dealing with ac signals. Airflow reduces θJA. In addition, more metal directly in contact with the package leads from metal traces, through holes, ground, and power planes reduces the θJA. Figure 3 shows the maximum safe power dissipation in the package vs. the ambient temperature for the 8-lead SOIC (125°C/W) and 8-lead LFCSP (θJA = 70°C/W) on a JEDEC standard 4-layer board. θJA values are approximations. –40 –20 –10 –30 0 10 20 30 40 50 60 70 80 90 100 110 120 3.0 1.0 1.5 0.5 2.0 2.5 0 AMBIENT TEMPERATURE (°C) SOIC-8 LFCSP Figure 3. Maximum Power Dissipation vs. Ambient Temperature for a 4-Layer Board ESD CAUTION |
Nº de peça semelhante - AD8137YRZ-REEL7 |
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Descrição semelhante - AD8137YRZ-REEL7 |
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