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CDCLVP2108RGZR Folha de dados(PDF) 2 Page - Texas Instruments |
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CDCLVP2108RGZR Folha de dados(HTML) 2 Page - Texas Instruments |
2 / 24 page CDCLVP2108 SCAS878B – MAY 2009 – REVISED AUGUST 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Table 1. AVAILABLE OPTIONS(1) TA PACKAGED DEVICES FEATURES CDCLVP2108RGZT 48-pin QFN (RGZ) package, small tape and reel –40°C to +85°C CDCLVP2108RGZR 48-pin QFN (RGZ) package, tape and reel (1) For the most current specifications and package information, see the Package Option Addendum located at the end of this data sheet or refer to our web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range (unless otherwise noted). (1) CDCLVP2108 UNIT VCC Supply voltage range(2) –0.5 to 4.6 V VIN Input voltage range (3) –0.5 to VCC + 0.5 V VOUT Output voltage range (3) –0.5 to VCC + 0.5 V IIN Input current 20 mA IOUT Output current 50 mA TA Specified free-air temperature range (no airflow) –40 to +85 °C TSTG Storage temperature range –65 to +150 °C TJ Maximum junction temperature +125 °C ESD Electrostatic discharge (HBM) 2 kV (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All supply voltages must be supplied simultaneously. (3) The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed. RECOMMENDED OPERATING CONDITIONS Over operating free-air temperature range (unless otherwise noted). CDCLVP2108 PARAMETER MIN TYP MAX UNIT VCC Supply voltage 2.375 2.50/3.30 3.60 V TA Ambient temperature –40 +85 °C PACKAGE DISSIPATION RATINGS (1) (2) VALUE TEST 4 × 4 VIAS PARAMETER CONDITIONS ON PAD UNIT 0 LFM 33.8 °C/W θJA Thermal resistance, junction-to-ambient 150 LFM 22.6 °C/W 400 LFM 19.2 °C/W θJP (3) Thermal resistance, junction-to-pad 3.67 °C/W (1) The package thermal resistance is calculated in accordance with JESD 51 and JEDEC 2S2P (high-K board). (2) Connected to GND with 16 thermal vias (0.3-mm diameter). (3) θJP (junction-to-pad) is used for the QFN package, because the primary heat flow is from the junction to the GND pad of the QFN package. 2 Submit Documentation Feedback Copyright © 2009–2011, Texas Instruments Incorporated Product Folder Link(s): CDCLVP2108 |
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