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5 / 56 page 139036 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.6 — 10 March 2011 139036 5 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 6. Wafer layout and pinning information 6.1 Wafer layout (1) X-scribe line width: 56.4 μm (2) Y-scribe line width: 56.4 μm (3) Chip step, x-length: 488.0 μm (4) Chip step, y-length: 470,0 μm (5) Bump to bump distance X (TP1 - RFN): 351,0 μm (6) Bump to bump distance Y (RFN - RFP): 333,0 μm (7) Distance bump to metal sealring X: 40,3 μm (8) Distance bump to metal sealring Y: 40,3 μm Bump size X x Y: 60 μm x 60 μm Fig 2. Wafer layout and pinning information 001aai346 not to scale! (1) (7) (2) (8) (5) (6) (4) (3) Y X TP2 TP1 RFN RFP |
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