TPS1110, TPS1110Y

SINGLE P-CHANNEL LOGIC-LEVEL MOSFETS

SLVS100B – OCTOBER 1994 – REVISED JANUARY 1998

2

POST OFFICE BOX 655303

TPS1110Y chip information

This chip, when properly assembled, displays characteristics similar to the TPS1110C. Thermal compression

or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%

ALL DIMENSIONS ARE IN MILS

TPS1110Y

(2)

(6)

(1)

(3)

(7)

(8)

(5)

(4)

DRAIN

SOURCE

SOURCE

SOURCE

GATE

DRAIN

DRAIN

DRAIN

57

64

(2)

(1)

(3)

(4)

(6)

(7)

(8)

(5)