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TMP47C201PG Folha de dados(PDF) 3 Page - Toshiba Semiconductor |
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TMP47C201PG Folha de dados(HTML) 3 Page - Toshiba Semiconductor |
3 / 42 page TMP47C101/201 II 2008-03-06 1. Part number 2. Package code and dimensions Previous Part Number (in Body Text) Previous Package Code (in Body Text) New Part Number New Package Code OTP TMP47C101P P-DIP16-300-2.54A TMP47C101PG DIP16-P-300-2.54A TMP47P201VPG TMP47C101M P-SOP16-300-1.27 TMP47C101MG SOP16-P-300-1.27 — TMP47C201P P-DIP16-300-2.54A TMP47C201PG DIP16-P-300-2.54A TMP47P201VPG TMP47C201M P-SOP16-300-1.27 TMP47C201MG SOP16-P-300-1.27 — *: For the dimensions of the new package, see the attached Package Dimensions diagram. 3. Addition of notes on lead solderability The following solderability test is conducted on the new device. Lead solderability of Pb-free devices (with the G suffix) Test Test Conditions Remark Solderability (1) Use of Lead (Pb) · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Lead (Pb)-Free · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux Leads with over 95% solder coverage till lead forming are acceptable. |
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