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AD20MSP415 Folha de dados(PDF) 7 Page - Analog Devices |
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AD20MSP415 Folha de dados(HTML) 7 Page - Analog Devices |
7 / 8 page AD20msp415 –7– REV. 0 MECHANICAL CONSIDERATIONS The chipset has been specifically designed to meet not only cost and power consumption requirements but also the physical dimensions. State-of-the-art package technology was used to achieve the smallest possible geometries. (See Table II for list of packaging dimensions and consult individual data sheets of the two components for further details.) Table II. Package Dimensions Parameter GSMP VBC EFR* Unit Package TQFP TQFP TQFP Leads 144 64 64 # Pitch 0.5 0.5 0.5 mm Body 20 × 20 10 × 10 10 × 10 mm 2 Total Height 1.6 1.6 1.6 mm Board Area 22 × 22 12 × 12 12 × 12 mm 2 *The EFR Coprocessor is needed only in systems requiring support of Enhanced Full Rate Speech Codec. All components use low profile Plastic Quad Flatpacks with lead pitches of 0.5 mm, for PCMCIA applications. ORDERING GUIDE Part Number Supply Voltage Range AD6421AST +2.7 V to +3.3 V AD6422AST +2.7 V to +3.3 V AD6423 +2.7 V to +3.3 V An Evaluation and Development system may be ordered for this chipset, under the part number, NRE20msp415EB1. |
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