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AD7816AR Folha de dados(PDF) 6 Page - Analog Devices

Nome de Peças AD7816AR
Descrição Electrónicos  Single- and 4-Channel, 9 us, 10-Bit ADCs with On-Chip Temperature Sensor
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Fabricante Electrônico  AD [Analog Devices]
Página de início  http://www.analog.com
Logo AD - Analog Devices

AD7816AR Folha de dados(HTML) 6 Page - Analog Devices

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REV. C
–6–
AD7816/AD7817/AD7818
ABSOLUTE MAXIMUM RATINGS
1
(T
A = 25
°C unless otherwise noted)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Input Voltage to AGND
VIN1 to VIN4 . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Reference Input Voltage to AGND
2
. . . –0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND . . . . . . –0.3 V to VDD + 0.3 V
Digital Output Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V
Storage Temperature Range . . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
TSSOP, Power Dissipation . . . . . . . . . . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 120
°C/W
Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . 260
°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
16-Lead SOIC Package, Power Dissipation . . . . . . . . 450 mW
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 100
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
8-Lead SOIC Package, Power Dissipation . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 157°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
µSOIC Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 206
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
2If the Reference Input Voltage is likely to exceed V
DD by more than 0.3 V (e.g.,
during power-up) and the reference is capable of supplying 30 mA or more, it is
recommended to use a clamping diode between the REFIN pin and VDD pin. The
diagram below shows how the diode should be connected.
REFIN
VDD
BAT81
AD7816/AD7817


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